Description
Special Request:
1. The finished 0.4mm hole is a press fit hole, with a hole tolerance: ±0.05mm, and copper plating in the hole: 25-50um.
2. Impedance requirements.
3. The 0.2mm via requires resin plug and electroplated fill, in accordance with IPC 4761 VII.
4. Blind vias in layers L1-L3 & L10-L8 require resin plug and electroplated fill, in accordance with IPC 4761 VII.
Layer: 10L
Base Material: FR4 TG180℃
Board Thickness: 1.8mm
Outer Layer Final Copper Thickness: 42UM
Inner Layer Final Copper Thickness: 0.5OZ&1OZ
Base Copper Thickness: 0.5OZ
Surface Finished: ENIG
Unit Size(mm): 170.00*270.00
Min. W/S(mil): 3.937/3.56
Min. Hole Size: 0.2mm