Layer: 2L
Base Material: FR4 TG≥135℃
Board Thickness: 1.6mm
Final Copper Thickness: 1OZ
Surface Finished: ENIG
Unit Size(mm): 50.00*120.00
Min. W/S(mil): 7.87/7.87
Min. Hole Size: 0.3mm
Solder Mask: Black
