Description
Special Request:
1. Vias Plugged with Resin+Copper Cap Plating of Filled Holes;
2. Metallised half slot, Half hole, Press fit hole.
Layer: 4L
Base Material: FR4 TG180℃
Board Thickness: 1.6mm
Final Copper Thickness: 1OZ
Surface Finished: ENIG
Unit Size(mm): 20.02*79.40
Min. W/S(mil): 10/5.97
Min. Hole Size: 0.25mm