Description
Layer: 2L
Base Material: FR4(TG150℃)+FPC(PI 50um)
Board Thickness:
Rigid Area: 1.6±0.16mm;
Flex Area: 0.15±0.03mm
Final Copper Thickness: 1OZ
Surface Finished: ENIG
Unit Size(mm): 141.91*124.50
Min. W/S(mil): 5.9/6.89
Min. Hole Size: 0.2mm
Solder Mask: Green+Yellow coverlay