

Layer: 1L
Base Material: PI(50UM)
Board Thickness: FPC Area: 0.12+/-0.03mm;
FPC+FR4 Stiffener Area: 1.74+/-0.174mm
Final Copper Thickness: 24.9um
Base Copper Thickness: 1OZ
Surface Finished: ENIG
Unit Size(mm): 428.00*178.00
Solder Mask: Yellow coverlay